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Main Technologies

Technologies

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Advanced Ceramic Processing
  • Laser Machining, Cutting, Scribing, Drilling 
  • Laser Ablation, Laser Marking
  • Diamond Dicing and Profiling
  • Lapping and Polishing
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Metallization
  • Thick Film
  • Thin Film
  • DBC & AMB  
  • Electro- and Electroless Plating
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Hybrid Assembly
  • Design & Engineering
  • Die Attach 
  • Wire Bonding
  • Sealing/Encapsulation