The Company

C-Component offers a comprehensive range of cost-effective custom and semi-custom products and services, including advanced ceramic components, various metallization techniques, and packaging solutions. 

With a strong legacy of quality engineering, we collaborate closely with our customers to develop and produce sophisticated products for automotive, semiconductor, microwave, aerospace, and defense applications. 

Our advanced manufacturing facilities, coupled with extensive expertise and scientific potential, enable us to deliver highly competitive products, from experimental batches to high-volume production for conveyor supply.

TECHNOLOGICAL EXPERTISE

Advanced Ceramic Processing

• Wide Range of Materials: 96% and 99.6% Al2O3 , AlN, Si3N4, ferrite, etc
• Precision Laser Processing: machining, drilling, cutting, scribing, ablation, marking
• Diamond Dicing and Profiling
• Lapping and Polishing

• Technical Glasses and Thick-Film Pastes: synthesis, analysis, development, manufacturing (including those without analogues)
• Thermally Conductive Materials: development and manufacturing of high-performance thermal interface materials
• Development of unique MEMS structures for gas sensing devices

• Thick Film Metallization: conductors (Ag, AgPd, AgPt, Au, Ru, Pt), resistors and thermistors (Ru, RuPdAg, Pt), glass coating
• Thin Film Metallization: Cr, V, Ti, NiCr, Ni, Nb, Cu, Al, Au, Pt, Si alloy
• Direct Bonded Copper: special processing, including laser etching
• Electro- and Electroless Plating: Ni, Au, ENIG, ENIPIG, Ag; solder masking

• Die Attach: epoxy, solder
• Wire Bonding: Al, Au, Pt wire; ultrasonic or thermocompression bonding
• Sealing/Encapsulation: epoxy, solder, glass, laser welding